Mfg Part Number: B160003-0000 | Alternate P/N: B1600030000 | Manufacturer: Micropac Industries Inc |
NSN : 5961-01-013-0960 | NIIN : 010130960 | Item Name : rectifier semicondu |
CAGE Code : 31757 | FSC : 5961 Semiconductor Devices and Associated Hardware |
Thank you for your interest in our available NSN part B160003-0000 on Single Source Purchasing! Our purchasing platform is owned and operated by ASAP Semiconductor, so quality is the cornerstone of our operations. If you are in the market for in-demand Plate Rectifier Semicondu parts like B160003-0000 with NSN 5961-01-013-0960, we are your parts procurement partner. Our inventory of over 2 billion new, used, obsolete, and hard-to-find parts comprises only premium items like part number B160003-0000, from trusted manufacturers, such as Micropac Industries Inc, and others. We invite you to browse our catalog until you find a part you wish to procure. Then, simply fill out a Request for Quote form with as much detail as possible, including target prices, shipping deadlines, and desired quantities. Within 15 minutes, our team of experts will contact you with a custom quotation for the NSN part B160003-0000 that fits your needs.
For your ease-of-purchasing, we always list our parts with as much information as possible. For example, you can locate NSN 5961-01-013-0960 alongside the CAGE Code 31757 and the manufacturer Micropac Industries Inc. Furthermore, all parts are shipped alongside their qualifying certifications and manufacturing trace documentation, as applicable. Kick off the parts procurement process today to discover why our loyal customers continuously rely on us to handle their sourcing, logistics management, shipping, and quality management for them so that they can continue to focus on what they do best!
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5961-01-013-0960 Item Description: Rectifier Semicondu | 5961 | 010130960 | 0 | N | A | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | A | U | ||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
B160003-0000 | 5 | 9 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ABHP | OVERALL LENGTH | 1.850 INCHES MAXIMUM |
ABKW | OVERALL HEIGHT | 0.740 INCHES MAXIMUM |
ABMK | OVERALL WIDTH | 1.850 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | -30.0/+100.0 DEG CELSIUS |
AGAV | END ITEM IDENTIFICATION | DISTANCE MEASURING EQUIPMENT (DME) |
AJUR | CIRCUIT CONNECTION STYLE DESIGNATOR | BRIDGE 1 PHASE |
AXGY | MOUNTING METHOD | UNTHREADED HOLE |
FEAT | SPECIAL FEATURES | GROUNDED TERMINAL NOT INCLUDED; RESISTIVE LOAD; MOUNTING HOLE 0.187 IN.DIA; HERMETICALLY SEALED; 4.2 KILOVOLTRMS AND 650.000 MILLIAMPERES DC |
MATT | III MATERIAL | SILICON |
TTQY | TERMINAL TYPE AND QUANTITY | 4 TAB, SOLDER LUG |
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