| Mfg Part Number: PAL16R4DMW 883B | Alternate P/N: PAL16R4DMW883B | Manufacturer: Mmi Amd |
| NSN : 5962-01-307-5784 | NIIN : 013075784 | Item Name : microcircuit memory |
| CAGE Code : 50364 | FSC : 5962 Microcircuits Electronic |
Thank you for your interest in our available NSN part PAL16R4DMW 883B on Single Source Purchasing! Our purchasing platform is owned and operated by ASAP Semiconductor, so quality is the cornerstone of our operations. If you are in the market for in-demand Plate Microcircuit Memory parts like PAL16R4DMW 883B with NSN 5962-01-307-5784, we are your parts procurement partner. Our inventory of over 2 billion new, used, obsolete, and hard-to-find parts comprises only premium items like part number PAL16R4DMW 883B, from trusted manufacturers, such as Mmi Amd, and others. We invite you to browse our catalog until you find a part you wish to procure. Then, simply fill out a Request for Quote form with as much detail as possible, including target prices, shipping deadlines, and desired quantities. Within 15 minutes, our team of experts will contact you with a custom quotation for the NSN part PAL16R4DMW 883B that fits your needs.
For your ease-of-purchasing, we always list our parts with as much information as possible. For example, you can locate NSN 5962-01-307-5784 alongside the CAGE Code 50364 and the manufacturer Mmi Amd. Furthermore, all parts are shipped alongside their qualifying certifications and manufacturing trace documentation, as applicable. Kick off the parts procurement process today to discover why our loyal customers continuously rely on us to handle their sourcing, logistics management, shipping, and quality management for them so that they can continue to focus on what they do best!
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-307-5784 Item Description: Microcircuit Memory | 5962 | 013075784 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Pal16r4dmw 883b | 5 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABHP | OVERALL LENGTH | 0.540 INCHES MAXIMUM |
| ABKW | OVERALL HEIGHT | 0.100 INCHES MAXIMUM |
| ADAQ | BODY LENGTH | 0.540 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.300 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.100 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.2 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | BIPOLAR AND BURN IN AND MONOLITHIC AND PROGRAMMABLE AND W/RESISTOR |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | F-9 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 FLAT LEADS |
| ABMK | OVERALL WIDTH | 1.040 INCHES MAXIMUM |
| CQWX | OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS NOMINAL POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | PAL |
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