Mfg Part Number: 13084712 | Manufacturer: Program Manager Advanced Attack | NSN : 5962-01-263-5903 |
NIIN : 012635903 | Item Name : microcircuit memory | CAGE Code : 58260 |
FSC : 5962 Microcircuits Electronic |
Thank you for your interest in our available NSN part 13084712 on Single Source Purchasing! Our purchasing platform is owned and operated by ASAP Semiconductor, so quality is the cornerstone of our operations. If you are in the market for in-demand Plate Microcircuit Memory parts like 13084712 with NSN 5962-01-263-5903, we are your parts procurement partner. Our inventory of over 2 billion new, used, obsolete, and hard-to-find parts comprises only premium items like part number 13084712, from trusted manufacturers, such as Program Manager Advanced Attack, and others. We invite you to browse our catalog until you find a part you wish to procure. Then, simply fill out a Request for Quote form with as much detail as possible, including target prices, shipping deadlines, and desired quantities. Within 15 minutes, our team of experts will contact you with a custom quotation for the NSN part 13084712 that fits your needs.
For your ease-of-purchasing, we always list our parts with as much information as possible. For example, you can locate NSN 5962-01-263-5903 alongside the CAGE Code 58260 and the manufacturer Program Manager Advanced Attack. Furthermore, all parts are shipped alongside their qualifying certifications and manufacturing trace documentation, as applicable. Kick off the parts procurement process today to discover why our loyal customers continuously rely on us to handle their sourcing, logistics management, shipping, and quality management for them so that they can continue to focus on what they do best!
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-263-5903 Item Description: Microcircuit Memory | 5962 | 012635903 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
7 | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
13084712 | 2 | 1 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 1.290 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.210 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND SCHOTTKY AND W/ENABLE AND ELECTROSTATIC SENSITIVE |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 14 INPUT |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-3 MIL-M-38510 |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
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